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| TDA1904 4W AUDIO AMPLIFIER HIGH OUTPUT CURRENT CAPABILITY PROTECTION AGAINST CHIP OVERTEMPERATURE LOW NOISE HIGH SUPPLY VOLTAGE REJECTION SUPPLY VOLTAGE RANGE: 4V TO 20V DESCRIPTION The TDA 1904 is a monolithic integrated circuit in POWERDIP package intended for use as low-frequency power amplifier in wide range of applications in portable radio and TV sets. ABSOLUTE MAXIMUM RATINGS Symbol VS IO IO Ptot Supply voltage Peak output current (non repetitive) Peak output current (repetitive) Total power dissipation at Tamb = 80C at Tpins = 60C Tstg, Tj Storage and junction temperature Parameter Value 20 2.5 2 1 6 -40 to 150 Unit V A A W W C Powerdip (8 + 8) ORDERING NUMBER : TDA 1904 TEST AND APPLICATION CIRCUIT (*) R4 is necessary only for Vs < 6V. March 1993 1/10 TDA1904 PIN CONNECTION (top view) SCHEMATIC DIAGRAM THERMAL DATA Symbol Rth-j-case Rth-j-amb Thermal resistance junction-pins Thermal resistance junction-ambient Parameter max max Value 15 70 Unit C/W C/W 2/10 TDA1904 ELECTRICAL CHARACTERISTICS (Refer to the test circuit, Tamb = 25 C, Rth (heatsink) = 20 C/W, unless otherwisw specified) Symbol Vs Vo Id Po Parameter Supply voltage Quiescent output voltage Quiescent drain current Output power Vs = 4V Vs = 14V Vs = 9V Vs = 14V d = 10% Vs = 9V Vs = 14V Vs = 12V Vs = 6V f = 1 KHz RL = 4 1.8 4 3.1 0.7 Test conditions Min. 4 2.1 7.2 8 10 2 4.5 15 18 Typ. Max. 20 Unit V V mA W d Harmonic distortion f = 1 KHz Vs = 9V R L = 4 Po = 50 mW to 1.2W Vs = 9V Vs = 14V f = 1 KHz f = 1 KHz Vs = 9V Vs = 14V Vs = 14V Vs = 14V f = 1 KHz Vs = 14V f = 1 KHz R g = 50 R g = 10 K R g = 50 R g = 10 K RL = 4 Po = 1W () () 39.5 RL = 4 RL = 4 Po = 2W Po = 4.5W 0.8 1.3 55 0.1 0.3 % Vi Ri Input saturation voltage (rms) Input resistance (pin 8) Efficiency V 150 70 65 40 to 40,000 75 40 1.2 2 2 3 40.5 K % Hz dB dB V V BW Gv Gv eN Small signal bandwidth (-3 dB) Voltage gain (open loop) Voltage gain (closed loop) Total input noise RL = 4 4 SVR Supply voltage rejection Vs = 12V fripple = 100 Hz Vripple = 0.5 Vrms Ptot = 2W Rg = 10 K 40 50 120 dB EC Tsd Thermal shut-down case temperature Note: () Weighting filter = curve A. () Filter with noise bendwidth: 22Hz to 22 KHz. 3/10 TDA1904 Figure 1. Test and application circuit (*) R4 is necessary only for VS < 6V Figure 2. P.C. board and components layout of fig. 1 (1 : 1 scale) 4/10 TDA1904 APPLICATION SUGGESTION The recommended values of the external components are those shown on the application circuit of fig. 1. When the supply voltage VS is less than 6V, a 68 resistor must be connected between pin 2 and pin 3 in order to obtain the maximum output power. Different values can be used. The following table can help the designer. Components Recomm. value Purpose Larger than recommended value Smaller than recommended value Allowed range Min. Max. R1 10 K Feedback resistors Increase of gain. Decrease of gain. Increase quiescent current. Increase of gain. 9R3 R2 R3 100 4.7 Frequency stability Decrease of gain. Danger of oscillation at high frequencies with inductive loads. 1 K R4 68 Increase of the output swing with low supply voltage. Input DC decoupling. Higher cost lower noise. Higher low frequency cutoff. Higher noise. Danger of oscillations. Increase of SVR increase of the switch-on time. Increase of the switch-on noise Degradation of SVR. 39 220 C1 2.2 F C2 0.1 F 22 F Supply voltage bypass. Ripple rejection C3 2.2 F 100F C4 2.2 F 47 F Inverting input DC decoupling. Bootstrap. Higher low frequency cutoff. Increase of the distortion at low frequency. Danger of oscillation. Higher low frequency cutoff. 0.1 F 10 F C5 100F C6 C7 0.22 F 1000 F Frequency stability. Output DC decoupling 5/10 TDA1904 Figure 3. Quiescent output voltage vs. supply voltage Figure 4. Quiescent drain current vs. supply voltage Figure 5. Output power vs. supply voltage F igu r e 6. Di sto rtion v s. output power Fi gur e 7. Distortion vs. output power F ig u re 8 . Di sto rtion vs . output power F igu r e 9. Di sto rtion v s. output power Figure 10. Distortion vs. output power Figure 11. Distortion vs. output power 6/10 TDA1904 Figure 12. Distortion vs. frequency Figure 13. Distortion vs. frequency Figure 14. Distortion vs. frequency Figure 15. Distortion vs. frequency Figure 16. Supply voltage rejection vs. frequency F i gu r e 1 7 . Total po wer dissipation and efficiency vs. output power F i gu re 1 8. Total po w er dissipation and efficiency vs. output power F i gu r e 1 9. Tota l p o we r dissipation and efficiency vs. output power F i gu r e 2 0 . Total po wer dissipation and efficiency vs. output power 7/10 TDA1904 THERMAL SHUT-DOWN The presence of a thermal limiting circuit offers the following advantages: 1) An overload on the output (even if it is permanent), or an above limit ambient temperature can be easily tolerated since the Tj cannot be higher than 150C. 2) The heatsink can have a smallerfactor of safety compared with that of a conventional circuit. There is no possibility of device damage due to high junction temperature. If for any reason, the junction temperature increase up to 150C, the thermal shut-down simply reduces the power dissipation and the current consumption. MOUNTING INSTRUCTION The TDA 1904 is assembled in the Powerdip, in which 8 pins (from 9 to 16)are attachedto the frame and remove the heat produced by the chip. Figure 21 shows a PC board copper area used as a heatsink (I = 65 mm). The thermal resistance junction-ambient is 35C. Figure 21. Example of heatsink using PC board copper (l = 65 mm) 8/10 TDA1904 POWERDIP PACKAGE MECHANICAL DATA DIM. MIN. a1 B b b1 D E e e3 F I L Z 3.30 1.27 8.80 2.54 17.78 7.10 5.10 0.130 0.050 0.38 0.51 0.85 0.50 0.50 20.0 0.346 0.100 0.700 0.280 0.201 0.015 1.40 mm TYP. MAX. MIN. 0.020 0.033 0.020 0.020 0.787 0.055 inch TYP. MAX. 9/10 TDA1904 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A. 10/10 |
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